Everything shaping
the world of cooling.
Technology, companies and events worldwide
Chinese thermal management manufacturer Tongfei has signed a long-term partnership agreement with Canadian CES Corporation in the field of data center liquid cooling. The partnership provides access to North American projects through Intelliflex's modular infrastructure, though specific products, order volumes, and delivery schedules have not yet been disclosed.
According to IDC, revenue of liquid-cooling server suppliers in China grew 153.1% year-on-year in H1 2026, with a projected five-year CAGR of approximately 49%. The key shift is the move from selling individual components to delivering pre-integrated, rack-level systems, which is restructuring roles across the thermal management supply chain.
Swedish research institute RISE has announced the COLLINS project to develop a digital twin of the entire liquid cooling chain for data centers handling AI workloads. Modelon AB is the project coordinator; partners include Vertiv, SWEP, LU-VE, and others. Project timeline: September 2026 – August 2029.
The ChemSec report, with technical support from Fraunhofer IZM (October 2026), systematizes PFAS-free alternatives for electronics cooling. Single-phase liquid systems — both immersion and direct-to-chip — already function without fluorinated heat-transfer fluids. Two-phase solutions, where the fluid evaporates during heat removal, remain in the pre-commercial stage; ChemSec questions the 13.5-year grace period proposed by the EU for restricting PFAS in two-phase immersion cooling.
D60-W combines liquid and air cooling with chillers, dry coolers and coordinated controls.
Companies, research and refrigeration events across borders.
Original sources help you explore the details and understand the context.
Available translations are linked on every story and reviewed by an editor.
