Markets & companies
Tongfei and Canadian CES Sign Strategic Agreement on Data Center Liquid Cooling
Chinese thermal management manufacturer Tongfei has signed a long-term partnership agreement with Canadian CES Corporation in the field of data center liquid cooling. The partnership provides access to North American projects through Intelliflex's modular infrastructure, though specific products, order volumes, and delivery schedules have not yet been disclosed.

Tongfei Co. and Canadian CES Corporation have signed a strategic agreement on a long-term partnership in data center liquid cooling. The parties intend to jointly provide clients and their projects with thermal management systems, which, according to analysts, creates a channel for the Chinese manufacturer into the North American AI infrastructure market.
What the Partner Brings
Canadian CES, through its subsidiary Intelliflex, specializes in modular data center infrastructure. The flagship solution, OctoPod, is a modular AI data center that, according to the company's official website, supports computing power of up to 8.8 MW and accommodates up to 80 racks; the PUE range is 1.2–1.4. CES has manufacturing facilities in Canada and the United States; according to the website, North American production capacity exceeds 250,000 square feet. Intelliflex's U.S. subsidiary, together with Supermicro, is implementing rapid-deployment AI data center projects, while World Wide Technology serves as the authorized sales channel for OctoPod.
Tongfei's Portfolio and Experience
Tongfei develops liquid cooling solutions in both cold-plate and full immersion formats. The product line covers CDU, Manifold, factory-assembled piping, outdoor dry coolers, integrated cooling stations, and immersion cooling tanks. The company has been working in the industrial thermal management segment for more than 20 years, serving industries including machine tool manufacturing, laser technology, energy storage, and semiconductor production.
Market Context
The data center liquid cooling supply chain is conditionally divided into two levels. Chip-adjacent components — CDU, Manifold, cold-plate, immersion tanks — require lengthy validation and adaptation to specific server and chip platforms. The facility level — chillers, dry coolers, and other heat sources — addresses the general cooling needs of a data center. As AI computing infrastructure expands, competition in the data center thermal management segment is spreading across more links in the supply chain.
Caveats and Analytical Assessment
At the time of publication, the parties had not disclosed the list of specific products, order volumes, or delivery schedules under the agreement; the conversion of the partnership into actual contracts will depend on the progress of projects. The electrical engineering and new energy team at Zheshang Securities, in a same-day event review, confirmed a «continue to recommend» rating and noted that the signing of the agreement further confirms Tongfei's business competencies, and that the turning point for scaling up liquid cooling in AIDC may have already arrived.
Source: Refrigeration Express.
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