Components & controls
Liquid Cooling Piping in AI Data Centers: From Coolant Transport to Rack-Level Distribution
At Data Center Korea 2026 (November 4–6, aT Center, Seoul), several piping and valve manufacturers showcased liquid cooling solutions for AI data centers, covering main and distribution lines, rack manifolds, quick-coupling connections, and system valves.
At Data Center Korea 2026, held November 4–6 at the aT Center (Yangcheon District, Seoul), several piping manufacturers presented liquid cooling solutions for AI data centers.
A key trend demonstrated on the exhibition stands was the expansion of the piping system's role: beyond transporting cooling water, it now handles flow distribution to individual racks, service access during server replacement, and leak isolation at specific sections.
The showcased solutions include:
- main and distribution piping for cooling water;
- rack-level manifold devices (collectors);
- quick-coupling connections;
- valves and instrumentation matched to specific sections of the system.
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