OCP Global Summit 2026: From Cold Plate Selection to Co-Design of AI Server Cooling Systems
At OCP Global Summit 2026 in San Jose (October 2026), participants — Microsoft, Google, Rittal, Corintis, Wistron, Wiwynn, and others — demonstrated that the key question in AI data center cooling has shifted from selecting an individual component to system-level integration: flow distribution, vapor management, and co-design of chip, rack, and infrastructure. Specific results were presented: transition temperature reduction of up to ~10 °C (Microsoft), ~19–23 % (Corintis, NVIDIA H200), ~6.1 °C through TIM selection (Boston Materials), as well as data on two-phase and liquid cooling solutions.
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